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Sponsor
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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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| Industry Paper |
Cleaning of Silicone and Hydrocarbon Contact Residue Using Atmospheric Plasma
Contact residue from dicing tape and silicone gel trays can cause poor adhesion in chip and wafer bonding applications. ONTOS atmospheric plasma is used to clean surfaces prior to bonding.
ONTOS Equipment Systems
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Sponsor
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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