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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Industry Paper

IR Layer Release Technology for 3D Packaging and Logic Scaling

Revolutionary layer transfer approach that enables nanometer-precision release of ultra-thin bonded, deposited or grown layers from silicon carrier substrates using an IR laser and specially formulated inorganic release materials.

EV Group

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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science