Arm Aims to Democratize Chiplets

Summary
Arm's Total Design initiative, with 29 partners, drives chiplet innovation. Teaming up with Samsung and Rebellions, it launched a 64-core AI/CPU platform focused on AI/ML and HPC, prioritizing interoperability, 3D stacking, and cost-effective solutions.
EE Times

Read the Full Article

The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.