Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D

Innovative packaging technologies drive the pursuit of Moore's law, breaking down monolithic devices into chiplets for heterogeneous integration (HI) in system-in-package (SiP) designs. Standardization efforts and new workflows aim for industry-wide adoption.

Read the Full Article

The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.