Samsung gets US$6.4 billion from CHIPS Act, promises to bring HBM and advanced packaging to Texas

The US Department of Commerce and Samsung Electronics inked a preliminary deal on April 15, paving the way for up to $6.4 billion in direct funding. Samsung plans to inject over $40 billion into central Texas, focusing on bolstering HBM and 2.5D packaging capabilities.

Read the Full Article

The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.