Intel thinks glass substrates are a clear winner in multi-die packaging

Intel is unveiling a groundbreaking technology called "Glass Packaging" that promises to revolutionize semiconductor design and manufacturing. This innovative approach involves encapsulating chips in a glass shell, providing enhanced durability and thermal performance while maintaining high-speed data transmission. By eliminating the need for traditional ceramic and plastic packaging, Intel aims to reduce waste and enhance sustainability in the electronics industry. This breakthrough will have significant implications for a wide range of applications, from consumer electronics to data centers, offering greater reliability and improved performance. Intel's Glass Packaging marks a significant step forward in semiconductor packaging technology, poised to shape the future of the industry.
The Register

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