Technical Papers Index
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Apr 6, 2021
Semiconductor Device Innovation Driving Automotive Advances
Today's automobiles are computers on wheels, with some vehicles containing more than 3,500 semiconductors! How are auto engineers ensuring reliability ...
Henkel Corporation

Mar 23, 2021
Non-Surface Contact Approach For Device Flip
Not all wafer level packages can be sorted, picked, flipped and re-packaged using traditional vacuum tip technology. Non-surface contact handling ...
Royce Instruments

Mar 1, 2021
BGA Socket Considerations - Prototype to Reality
For products designed with high-performance integrated circuits, BGA socketing systems are an essential option during the design, testing, and/or production ...
Ironwood Electronics

Feb 22, 2021
EMI Shielding for System in Package Using Spray Coating and Silver Particle-Free Ink
This paper demonstrates the capability of EMI-207, a metal-complex conductive ink that sets the standard for particle-free conductive coatings, combined ...
EMD Electronics

Feb 8, 2021
Improved Wire Bond Reliability with Auxiliary Wires
Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. The motivation behind the ...
Palomar Technologies, Inc.

Jan 26, 2021
Adding Value with Unit Level Traceability (ULT) in Automotive Packaging
Automotive manufacturers rely on traceability to keep abreast of gaps in the value chain to meet end-user safety requirements. ...
Amkor Technology, Inc.

Jan 11, 2021
TLPS Paste Vias for High-Performance Printed Circuit Board Fabrication
Ormet® delivers high reliability anywhere and any layer vias for high density interconnects in complex printed circuit boards. ...
EMD Electronics

Jan 4, 2021
Full Wafer Double Sided Monolithic Lens Fabrication
In this paper, we discuss the capability of SUSS UV-imprint lithography together with an optically tailored, UV-curable epoxy resin from ...
SUSS MicroTec

Dec 21, 2020
Removing Underfill for Analysis of 2.5D Modules Using CF4-Free Microwave Induced Plasma
Selective removal of underfill on a 2.5D package to enable subsequent analysis on interposer interconnects and Cu µbumps in cross-section ...
JIACO Instruments

Dec 14, 2020
Side Wettable Flanks for Leadless Automotive Packaging
Amkor's Wettable Flank technology for QFN (MLF®) packages streamlines solder joint inspection, enabling automotive and PCB assemblers to eliminate manual ...
Amkor Technology, Inc.

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