Press Release Index
  Page 3 of 351  
Sep 15, 2021
CEA-Leti Proposes Nine Research Tracks to Guide ICT Industry's Quest to Reduce its Carbon Footprint
In an ambitious and urgent proposal to improve energy efficiency in new microelectronic hardware and systems by a factor of 1,000 by 2030, CEA-Leti has challenged the ICT ...

Sep 13, 2021
With more than US$5 billion in 2026, the InP bare die market is offering opportunities and profits
"At Yole, we expect an initial slight market penetration of InP in 2022 in wearables, followed by a significant increase to US$255 million in 2026 with a CAGR2022-2026 of 112%." ...
Yole Développement

Sep 13, 2021
Second Quarter 2021 Global Semiconductor Equipment Billings Surge 48% YoY
Global semiconductor equipment billings surged 48% year-over-year to a record high of US$24.9 billion in the second quarter of 2021, a 5% increase from the prior quarter ...

Sep 10, 2021
X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing Capabilitie
Long-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for heterogeneous integration of different ...
X-FAB Silicon Foundries

Sep 10, 2021
Littelfuse CPC1596 Eliminates the Need for External Power Supply
Littelfuse, Inc. announced the first high-voltage optically-isolated MOSFET gate driver on the market that requires no external power supply, yet can provide fast load turn-on ...
Littelfuse, Inc.

Sep 10, 2021
Management change at Mycronic
Mycronic AB (publ) has appointed Pierre Brorsson as Chief Financial Officer effective October 25, 2021. A Swedish citizen born in 1972 with a MSc in Business Administration from ...
Mycronic AB

Sep 10, 2021
Aehr Receives $19.4 Million Order for Multiple FOX-XP™ Test and Burn-in Systems
Aehr Test Systems announced it has received a $19.4 million order from its lead silicon carbide test and burn-in customer for multiple FOX-XP systems to meet their increased ...
Aehr Test Systems

Sep 8, 2021
Hybrid bonding partnership SET-SUSS MicroTec
SUSS MicroTec and SET signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology. ...

Sep 8, 2021
Highlighting Our Grypper Sockets for Teledyne's Memory Products
Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use of semiconductor devices. IC packages covered include; QFN, BGA ...
Ironwood Electronics

Sep 8, 2021
LiDAR adoption: technology choices and supply chain management are the key enablers
"The market for LiDAR in automotive and industrial applications is expected to reach US$5.7 billion in 2026, showing a significant 21% CAGR between 2020 and 2026", asserts ...
Yole Développement

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address