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Viewpoint Index
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Feb 12, 2026
VIEWPOINT 2026: Joe Montano, President and CEO, Delphon
As Delphon enters 2026, the company is at a true inflection point — driven by execution, not ambition alone. Over the past several years, we've deliberately expanded beyond our historical niches to position Delphon deeper in the semiconductor value chain. That strategy is now translating into tangible ...
Feb 11, 2026
VIEWPOINT 2026: Stephen Rothrock, Founder & CEO, ATREG, Inc.
The rise of advanced packaging from back-end afterthought to strategic imperative is forcing difficult facility decisions across the global semiconductor industry. The infrastructure gap is stark. OSATs have traditionally operated in Class 10,000 cleanrooms. Hybrid bonding and other advanced techniques ...
Feb 10, 2026
VIEWPOINT 2026: Thomas Rodgers, Senior Director of Market Strategy, ZEISS Microscopy
The semiconductor industry is entering a new era where performance gains are increasingly delivered through advanced packaging, not just transistor scaling. Chiplets, 2.5D/3D integration, high bandwidth memory (HBM), hybrid bonding, and co-packaged optics (CPO) are enabling unprecedented bandwidth, power ...
Feb 9, 2026
VIEWPOINT 2026: Minoru Inoue, Branch Manager of Semiconductor Materials Sales Branch, Sekisui Chemical
2025, aside from the slowdown in demand for power semiconductors due to the EV recession, the market conditions were generally the same as or better than the previous year. The temporary market stagnation caused by the advance demand in anticipation of tariff increases largely subsided in the first half ...
Feb 6, 2026
VIEWPOINT 2026: Marc Engel, CEO, Agileo Automation
The shift toward advanced packaging (AP) is fundamentally reshaping semiconductor manufacturing, blurring the lines between front-end and back-end processes. For equipment manufacturers, this evolution demands a dual transformation in automation strategy. As back-end fabs adopt AP techniques, they are ...
Feb 5, 2026
VIEWPOINT 2026: Ramachandran "Ram" K. Trichur , Global Market Segment Head, Henkel
The semiconductor packaging growth story continues to be written by the demanding, complex requirements of AI and high-performance computing (HPC) in the cloud and at the edge. The automotive sector, which is expected to rebound after recent challenges, is also driving innovation through advanced ...
Feb 4, 2026
VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE
Talking about semiconductors in 2025 inevitably means discussing artificial intelligence (AI)—and the geopolitical challenges shaping the industry. However, we are seeing technological progress across many aspects of the industry. Single-digit nanometer logic technology is a fascinating segment ...
Feb 3, 2026
VIEWPOINT 2026: Doug Dixon, CEO, 360 BC Group Inc.
For 2026, we see semiconductor packaging entering its most transformative phase yet, driven by unprecedented demands from AI, high-density power electronics, heterogeneous integration, and the shift toward ultra-high-performance system architectures. As a technical marketing and content development ...
Feb 2, 2026
VIEWPOINT 2026: Greg DeLarge, President, Plasma Etch, Inc.
As we conclude another strong year, we are proud of the progress and innovation enjoyed by our organization and our customers. The performance and reliability of our plasma systems continue to be demonstrated across a wide range of applications from the circuit board industry to aerospace. We remain ...
Jan 30, 2026
VIEWPOINT 2026: Jochen Schuermans, Founder & CEO, Roartis
Known for specialisation in development of customized adhesive, micro-encapsulation, coating and sinter solutions for electronic assemblies, Roartis has again, in 2025, realized its best year ever. We feel that differentiation in technology, especially when offering customisation, fast, can really add significant value ...
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