Viewpoint Index
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Feb 12, 2020
VIEWPOINT 2020: Daniel Schultze, CEO, TRESKY Automation
The global semiconductor market was severely affected by the trade dispute between the United States and China. However, this did no harm to us. Due to our stable order situation we confirm the forecasts of economic experts for the semiconductor industry, which says that the demand for electronic components will ...

Feb 11, 2020
VIEWPOINT 2020: Bruce Hueners, President & CEO, Palomar Technologies
Over the past 40+ years in the industry, Palomar Technologies has been at the forefront of delivering advanced solutions for microelectronic and photonics device assembly across a wide range of segments including, aerospace, automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, and telecom. ...

Feb 10, 2020
VIEWPOINT 2020: Asif R Chowdhury, Senior VP, Marketing & Corporate Business Development & Japan Business, UTAC
2019 was unfortunately not a great year for overall semiconductor market. Analysts estimate that unit shipment in 2019 will be down by more than 4% - first time semiconductor unit shipment will go negative since 2001. Minus memory, part of slow 2019 was due to slow mobile handset sales which is one of the dominant users ...

Feb 7, 2020
VIEWPOINT 2020: Jeanne Beacham, President, Delphon Industries
Like many recent years in the Semiconductor Industry, 2020 is a difficult one to Forecast. As we all know too well - there are many unknowns in the Market. China clearly will have the biggest impact -- positively and negatively. In 2019 the impact of the China tariff dispute affected many companies. The growth of electronics ...

Feb 6, 2020
VIEWPOINT 2020: Joseph Fjelstad, President and Founder, Verdant Electronics
Peak Solder -- When… if ever? One of the pleasures of getting old was cited by Swedish director Ingmar Bergman who said: "Getting old is like climbing a mountain. The higher you get, the more tired and breathless you become, but your views become more extensive." Solder continues to hold center stage in the EMS ...

Feb 5, 2020
VIEWPOINT 2020: Yann Guillou, Global Marketing & Sales Director, Trymax Semiconductor Equipment B.V.
Plasma equipment solutions for Wafer Level Packaging manufacturers have been representing a significant stream of revenues for Trymax for many years. As an example, half of the top 10 OSATs and many large IDMs are using Trymax's solutions to perform various PR, PI, PbO, BCB etch or descum steps and different types ...

Feb 4, 2020
VIEWPOINT 2020: Ken Molitor, Chief Operating Officer, Quik-Pak
Companies' needs to get products to market quickly will increase, and we see demand for our services increasing accordingly. In the coming year, areas driving this demand from a silicon perspective will include RF, MEMS, sensors and power – all ripe for low-cost QFN [quad flat no-lead] applications. We believe RF will explode due to ...

Feb 3, 2020
VIEWPOINT 2020: Kim Arnold, Executive Director of Wafer-Level Packaging Materials, Brewer Science, Inc.
As we enter 2020, the China tariff dispute continues to be an issue for most companies in the semiconductor industry. We have seen two key areas where the tariffs have affected materials suppliers: 1. China is a growing market for packaging and other back-end processes, and 2. The tariff is having a big impact ...

Jan 31, 2020
VIEWPOINT 2020: Jim Fraine, Director of Sales, North America, Marvin Test Solutions
Much of the talk in the semiconductor world in 2019 revolved around smarter phones and cars. For smartphones it was the excitement of the advent of 5G technology to enable performance and functionality as never seen before. In the automotive world it is the race to autonomous driving bringing unparalleled productivity, comfort ...

Jan 30, 2020
VIEWPOINT 2020: Lena Nicolaides, Sr. V.P. and General Manager, KLA Corporation
Semiconductor packaging growth is expected to be strong in 2020, with accelerated innovation and increased adoption of advanced packaging technologies driven by megatrends such as AI and 5G, spanning key industries like mobile, data center and automotive. Increasingly sophisticated heterogeneous integration schemes ...

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