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Jan 20, 2021 EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters EV Group (EVG) announced that it has established the EVG Academy, a training facility for customers that provides technical training on all classes of EVG equipment as well as on EVG's ... EV Group Jan 20, 2021 High Performance Socket for 0.15mm Pitch QFN Ironwood Electronics has recently introduced a new high performance QFN socket for 0.15mm pitch devices. The SS-QFN184A-01 socket, designed for a 9.2mmx6mm package size ... Ironwood Electronics Jan 20, 2021 EpoxiCast M21, Electronic Assembly adhesive epoxySet is showcasing the EPOXICAST™ M21, Low viscosity adhesive for advanced electronic assembly applications. It is designed for use as a filling epoxy in dam-and-fill encapsulations ... EpoxySet Inc. Jan 19, 2021 Will future soldiers be made of Semiconductor? "The global market for infantry equipment related to semiconductor technology will evolve from US$9.1 billion in 2020 to US$17.5 billion in 2030." asserts Alexis Debray, Technology ... Yole Développement Jan 19, 2021 Sondrel reduces lead times in SOC development via an early assignment of bumps in BGA packages Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing ... Sondrel Jan 19, 2021 SEGGER's complete J-Link software now available for Linux on ARM This includes both the command-line programs and GUI tools such as J-Flash, J-Flash SPI, J-Scope, the J-Link Configurator and the GUI version of the GDB Server. ... SEGGER Jan 18, 2021 New Release of YXLON Cheetah and Cougar EVO Microfocus X-ray Systems Yxlon presented the new release of the Cheetah and Cougar EVO microfocus X-ray families in three online events. Under the motto 'Innovation is key to Evolution - Evolution ... Yxlon Jan 18, 2021 Onto Innovation Announces New Inspection Platform Onto Innovation Inc. announced the availability of its new Dragonfly® G3 inspection platform designed to meet the most advanced 2D and 3D sensitivity requirements for advanced ... Onto Innovation Inc. Jan 18, 2021 UTAC completes acquisition of Singapore Wafer Bumping Assets UTAC Holdings Ltd. announced that its affiliate ("UTAC" or "the Company") has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology ... UTAC Group Jan 13, 2021 Semiconductor Materials $50B Market on a Strong Run in 2021 TECHCET announced that global revenues for semiconductor manufacturing and packaging materials grew approximately 4% year-over-year (YoY) in 2020 to ~US$50B ... TECHCET |
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