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Apr 6, 2021 Clamshell Spring Pin Socket for Intel FBGA Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for FineLine Ball grid Array - CBT-BGA-6111. The contactor is a stamped ... Ironwood Electronics Apr 5, 2021 CML Microcircuits' SµRF microwave RF solutions provide easy access to GHz bandwidths CML Microcircuits is pleased to announce SµRF, a new range of high frequency, high bandwidth RFICS and MMICs targeting RF and mmWave applications. As wireless communications ... CML Microcircuits Apr 5, 2021 ZEISS Opens High-Tech Center to Leverage New Digital and Other Market Opportunities in North America ZEISS has completed construction of its new R&D, production, sales and customer service site in the San Francisco Bay Area. Bringing together hundreds of ZEISS employees ... ZEISS Apr 1, 2021 Heraeus and Fraunhofer IISB launched a joint master's program Heraeus Electronics and the Fraunhofer Institute for Integrated Systems and Device Technology (IISB) recently launched a joint program for master's theses on power electronics. ... Heraeus Electronics Apr 1, 2021 Merger of Heidelberg Instruments and Multiphoton Optics strengthens German competitiveness Multiphoton Optics GmbH has become a wholly owned subsidiary of Heidelberg Instruments Mikrotechnik GmbH. The pooling of development capabilities and technologies ... Heidelberg Instruments Apr 1, 2021 Atotech to present at the 17th Conference on Device Packaging 2021 Atotech is pleased to announce its participation in the 17th International Conference on Device Packaging. The conference will be held virtually from April 12 – 15, 2021. ... Atotech Mar 31, 2021 YES Secures VertaCure XP Volume Purchase Order from Powertech Technology Inc. YES (Yield Engineering Systems, Inc.) announced that it has received a volume purchase order for the VertaCure™ XP from Taiwan-based OSAT Powertech Technology, Inc. ... Yield Engineering Systems, Inc. Mar 31, 2021 MacDermid Alpha to be a Supporting Partner at IMAPS Device Packaging Conference MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. ... MacDermid Alpha Electronics Solutions Mar 31, 2021 SEMI Joins UK Initiative to Promote Cybersecurity Adoption SEMI announced its participation as an industry expert in a study by researchers in Coventry University's Institute for Future Transport and Cities' (IFTC) Systems Security Group ... SEMI Mar 30, 2021 Indium Corporation Experts to Present at IMAPS Device Packaging Virtual Conference Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from ... Indium Corporation |
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