Press Release Index
PRIOR
  Page 2 of 311  
NEXT
SUBMIT A PRESS RELEASE
Jan 20, 2021
EV Group Establishes State-of-the-Art Customer Training Facility at Corporate Headquarters
EV Group (EVG) announced that it has established the EVG Academy, a training facility for customers that provides technical training on all classes of EVG equipment as well as on EVG's ...
EV Group

Jan 20, 2021
High Performance Socket for 0.15mm Pitch QFN
Ironwood Electronics has recently introduced a new high performance QFN socket for 0.15mm pitch devices. The SS-QFN184A-01 socket, designed for a 9.2mmx6mm package size ...
Ironwood Electronics

Jan 20, 2021
EpoxiCast M21, Electronic Assembly adhesive
epoxySet is showcasing the EPOXICAST™ M21, Low viscosity adhesive for advanced electronic assembly applications. It is designed for use as a filling epoxy in dam-and-fill encapsulations ...
EpoxySet Inc.

Jan 19, 2021
Will future soldiers be made of Semiconductor?
"The global market for infantry equipment related to semiconductor technology will evolve from US$9.1 billion in 2020 to US$17.5 billion in 2030." asserts Alexis Debray, Technology ...
Yole Développement

Jan 19, 2021
Sondrel reduces lead times in SOC development via an early assignment of bumps in BGA packages
Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing ...
Sondrel

Jan 19, 2021
SEGGER's complete J-Link software now available for Linux on ARM
This includes both the command-line programs and GUI tools such as J-Flash, J-Flash SPI, J-Scope, the J-Link Configurator and the GUI version of the GDB Server. ...
SEGGER

Jan 18, 2021
New Release of YXLON Cheetah and Cougar EVO Microfocus X-ray Systems
Yxlon presented the new release of the Cheetah and Cougar EVO microfocus X-ray families in three online events. Under the motto 'Innovation is key to Evolution - Evolution ...
Yxlon

Jan 18, 2021
Onto Innovation Announces New Inspection Platform
Onto Innovation Inc. announced the availability of its new Dragonfly® G3 inspection platform designed to meet the most advanced 2D and 3D sensitivity requirements for advanced ...
Onto Innovation Inc.

Jan 18, 2021
UTAC completes acquisition of Singapore Wafer Bumping Assets
UTAC Holdings Ltd. announced that its affiliate ("UTAC" or "the Company") has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology ...
UTAC Group

Jan 13, 2021
Semiconductor Materials $50B Market on a Strong Run in 2021
TECHCET announced that global revenues for semiconductor manufacturing and packaging materials grew approximately 4% year-over-year (YoY) in 2020 to ~US$50B ...
TECHCET

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address