Exclusive Articles
  Page 2 of 2  
Jun 21, 2012
3D-IC Progress on Display at SEMICON West 2012
Given their potential for smaller form factors, increased performance, and reduced cost and power consumption, 3D-IC technologies are now enabling the next generation of advanced semiconductor packaging. Already, 2.5D technology using silicon interposers to provide wide IO bandwidth and denser packaging have ...
Denny McGuirk, SEMI

May 8, 2012
Die Bonder Donation to a University or College Research Center
Finetech will donate a high accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. In conjunction with the company's 20th anniversary this year, Finetech is celebrating the university R&D segment of their business with this machine donation ...
Neil O'Brien, Finetech

Mar 12, 2012
iMAPS Device Packaging Conference
Semiconductor Packaging News was invited to attend the iMAPS Device Packaging Conference in Scottsdale, AZ. last week. The 8th annual conference brings together the microelectronics supply chain and the event was very successful as the conference exceeded ...
Ken Cavallaro, Semiconductor Pakaging News

Mar 5, 2012
Space Shuttle Spittle Video
Human contamination in IC manufacturing is a serious concern. The industry has come a long way in thirty years. In 1985 Dr Bob Thomas from USAF Rome Air Development Center gave a talk on the negative effects of human contamination on the reliability of ICs. In his ...
Thomas J Green, TJ Green Associates LLC

Feb 2, 2012
Lessons Learned from 3D DRAM-on-Logic Chip Development
Three-dimensional (3D) integration is considered a very promising technology for integrated circuit design. It provides numerous opportunities to designers looking for more cost-effective system chip solutions. It allows further decreasing the form factor of today's systems and eases the interconnect performance limitation. And it makes it possible to ...
Eric Beyne, imec

Jan 30, 2012
2012 IC Market Forecast
We were invited to attend an IC Insights seminar on the "The McClean Report" last week in Boston. The seminar was hosted by Bill McClean and Trevor Yancey for IC Insights and provided an excellent update on the semiconductor markets for 2012. The presentation included over 100 slides with analysis and forecast for the IC industry. I've summarized the highlights ...
Ken Cavallaro, Semiconductor Packagning News

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address