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22698 news listings.

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Apr 17, 2024
 SUMMARY 
Research Bits: April 16
Researchers at CiQUS and Forschungszentrum Juelich uncovered that oxide-based memristive devices exhibit adjustable thermal conductivity alongside electrical resistive switching. Oxygen ...
Semiconductor Engineering


Apr 17, 2024
 SUMMARY 
Intel urges collaboration between partners from Taiwan and India
At the Taiwan and India Ecosystem Partners Connection event on April 12, Grace Wang, Intel Taiwan's VP, urged partners to ...
Digitimes


Apr 16, 2024
 SUMMARY 
Architecting Chips For High-Performance Computing
Revolutionizing high-performance computing, chip architects employ innovative strategies, optimizing design for enhanced speed and efficiency. Advanced materials and novel architectures ...
Semiconductor Engineering


Apr 16, 2024
 SUMMARY 
U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
U.S. subsidies propel Taiwan Semiconductor Manufacturing Co. (TSMC) towards AI chip production, enhancing tech leadership. While the CHIPS Act boosts ...
EE Times


Apr 16, 2024
 SUMMARY 
SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas
The Semiconductor Industry Association (SIA) lauds the CHIPS Act for incentivizing Samsung's manufacturing projects in Texas, bolstering domestic semiconductor production. ...
Semiconductor Industry Association


Apr 16, 2024
 SUMMARY 
Apple iPhone first-quarter shipments sink as Chinese challengers rise; Samsung regains top spot
Apple's iPhone shipments dip as Chinese rivals surge in Q1, per IDC. Competitors like Xiaomi and Oppo gain ground, impacting ...
CNBC


Apr 16, 2024
 SUMMARY 
Powerchip reins in net losses by 79.2%
Powerchip Semiconductor Manufacturing Corp reported a 79.2% reduction in net losses last quarter, reaching NT$439 million, attributed to increased factory ...
Taipei Times


Apr 16, 2024
 SUMMARY 
Apple to boost spending in Vietnam
Apple CEO Tim Cook announced increased spending on Vietnamese suppliers during his two-day visit to Vietnam, aiming to bolster the ...
Taipei Times


Apr 16, 2024
 SUMMARY 
Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D
Innovative packaging technologies drive the pursuit of Moore's law, breaking down monolithic devices into chiplets for heterogeneous integration (HI) in ...
3DInCites


Apr 16, 2024
 SUMMARY 
Samsung gets US$6.4 billion from CHIPS Act, promises to bring HBM and advanced packaging to Texas
The US Department of Commerce and Samsung Electronics inked a preliminary deal on April 15, paving the way for up ...
Digitimes


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