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May 22, 2026 Asahi Kasei Develops Novel Photosensitive Polyimide Film Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation ... Asahi Kasei America Inc. May 22, 2026 PCIM: Plasma for High-Quality Power Modules How can power modules be manufactured to reliably function under increasing power densities, higher temperatures, and new material combinations? This question ... Plasmatreat May 22, 2026 ATS Thermal Engineering Subscription Program Provides Ongoing Engineering Support for OEM Needs Advanced Thermal Solutions, Inc. (ATS) now offers the ATS Engineering Subscription Program, providing on-demand access to senior-level thermal engineers to solve ... Advanced Thermal Solutions, Inc. May 22, 2026 STMicroelectronics announces enhanced version of industry-proven battery-management IC STMicroelectronics' L9963F automotive battery-management IC includes all the features needed to manage lithium battery packs in hybrid (HE) and full electric (FE) vehicles, ... ST Microelectronics May 21, 2026 Amkor Technology Expands U.S. Advanced Packaging Footprint with Additional Land in Arizona Amkor Technology, Inc. reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment ... Amkor Technology May 21, 2026 SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ... SEMI May 21, 2026 World first: imec presents quantum dot qubit device using High NA EUV lithography This week, at ITF World, imec presents a world first: a quantum dot qubit device fabricated using High NA EUV lithography. This achievement marks a milestone toward thr ... imec May 21, 2026 STMicroelectronics' new gate drivers boost economy, performance, and efficiency STMicroelectronics has introduced new STDRIVE102 gate-driver ICs for three-phase brushless motors, adding the STDRIVE102P and STDRIVE102BP that feature an SPI ... STMicroelectronics May 20, 2026 EV Group Highlights Technologies for Heterogeneous Integration at ECTC 2026 EV Group (EVG) announced that it will showcase its latest solutions for heterogeneous integration and advanced packaging at the 2026 IEEE Electronic Components and Technology ... EV Group May 20, 2026 SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ... SEMI |
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