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Sep 22, 2023 Decapsulation of Multi-Tier Wire-Bonded Semiconductors Decapsulation of packaged integrated circuits is routinely conducted in FA and reliability tests. In this work, we decapsulate a complex ... JIACO Instruments Sep 15, 2023 Series B : Adhesion and Bondibility of Al2O3-coated Bonding Wire Using Atomic Layer Deposition (ALD), we applied a nanoscale Al2O3 ceramic coating to metal bonding wires, enhancing adhesion, insulation, and ... OxWires Co., Ltd Sep 8, 2023 How to Select RF Test Socket Selecting the right RF test socket involves several factors – frequency, insertion loss, return loss, impedance matching, contact force, contact ... Ironwood Electronics Aug 31, 2023 3D Sensing Solutions Optical sensor packaging standardization for a growing market. Extending the MEMS and Sensor Platform to New Optical Sensors for Emerging ... Amkor Technology, Inc. Aug 24, 2023 Critical Cleaning Requirements to Overcome Advanced Packaging and Defluxing Challenges As technology advances, wafer-level packages have emerged in many different varieties. Computing has evolved significantly over the years. ... ZESTRON Americas Aug 11, 2023 Reliably Reinforce BGAs While Minimizing Stress on Solder Joints Learn how to reinforce BGAs while minimizing stress on solder joints with capillary underfill, edge bond and corner fill and ... DELO Aug 2, 2023 Series A: Electrical Insulation of Al2O3-Coated Bonding Wire We introduce ceramic (Al2O3) coating at nm scales deposited on metal wires for enhancing electrical insulation, adhesion to encapsulation and ... OxWires Co., Ltd Jul 25, 2023 Production Testing Of Discrete Power Products Test steps and parameters for new and established power technologies. ... Amkor Technology, Inc. Jul 19, 2023 Essential Inspection Requirements in the Era of Convergence The convergence of semiconductor packaging and board assembly is revolutionizing the industry with innovative inspection machines. This paper explores requirements ... Koh Young America, Inc. Jul 13, 2023 Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications In this paper, a novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling ... Brewer Science, Inc. |
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