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Jul 21, 2026 RISC-V Europe Summit 2026: Beyond Embedded Electronics RISC-V Summit Europe 2026 highlighted the architecture's rapid expansion into data centers, edge AI, robotics, and space. Backed by the ratified RVA23 server standard and growing industry adoption, RISC-V is emerging as a flexible, open alternative to Arm and x86. EE Times Jul 21, 2026 SK Group Chairman Says Abnormal Memory Prices Should Fall; AI Chip Demand Seen Up 60–100% Next Year SK Group Chairman Chey Tae-won warned AI-driven memory prices are unsustainably high and could raise PC and smartphone costs, hurting demand. He urged memory makers to expand capacity instead of limiting supply as AI demand outpaces production through 2027. TrendFore Jul 21, 2026 UMA: The Architecture Edge AI Needs to Scale As AI moves to edge devices, memory has overtaken compute as the biggest bottleneck. Unified Memory Architecture (UMA) lets CPUs, GPUs and NPUs share memory, boosting capacity and bandwidth so larger AI models and long-context workloads run reliably. EE Times Jul 21, 2026 AI is 'new engine' keeping Chinese economy from harder landing Artificial intelligence is powering China's slowing economy by boosting electronics, exports and industrial investment. Analysts say AI is lifting near-term growth and global competitiveness but warn the economy could weaken if AI investment momentum fades. Taipei Times Jul 21, 2026 AI boom drives US$100bn TSMC Arizona buildout TSMC will invest another US$100 billion in Arizona, bringing its total US commitment to US$265 billion as AI demand accelerates. The expansion boosts US chip production, supports key customers, strengthens competitiveness, and keeps leading-edge R&D in Taiwan. Taipei Times Jul 21, 2026 Ex-TSMC worker indicted for alleged trade secret theft Taiwan indicted a former TSMC deputy manager for allegedly stealing critical chip trade secrets to aid a China-based venture under the Blue Sea Project. Prosecutors seek a seven-year sentence in the first case involving attempted transfer of nationally protected chip technology. Taipei Times Jul 21, 2026 New study highlights how micro-transfer printing can lead to advanced silicon photonics Researchers spotlight micro-transfer printing as a scalable way to integrate advanced materials with CMOS-compatible silicon photonics, easing AI bandwidth bottlenecks. The approach enables heterogeneous chip manufacturing and speeds telecom, datacom, sensing & quantum innovation. Nanowerk Jul 21, 2026 Why China's open-weight AI model Kimi K3 is sparking anxiety in Silicon Valley Moonshot AI's open-source Kimi K3 has cut China's AI gap with the U.S. to weeks, outperforming several top American models at lower cost. Surging demand strained computing capacity, forcing the company to pause new subscriptions temporarily. South China Morning Post Jul 21, 2026 Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design Rapidus and Cadence are integrating the Cadence InnoStack AI Super Agent into the Raads platform to automate advanced-node SoC design workflows, boost engineering productivity, improve design quality, and target up to a twofold reduction in design turnaround time. 3DInCites Jul 21, 2026 Post-Quantum Cryptography Incorporated into SoCs via eFPGA QuickLogic and PQSecure integrated reprogrammable post-quantum cryptography into SoCs with embedded FPGA technology, enabling field updates without silicon redesign. The approach counters quantum threats, supports evolving NIST standards, and extends long-term security. EE Times |
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