October 7-9, 2025 | Phoenix Convention Center, Phoenix, Arizona
Koh Young’s Meister Series is purpose built for advanced packaging, including SiP, WLP, and die stacking metrology. These systems provide ultra high resolution 2D/3D measurement to manage features and tolerances in next generation designs. Complementing the Meister Series, the ZenStar delivers wafer level dimensional metrology to detect and quantify critical parameters at the earliest stage, ensuring only known good components advance. Together, these platforms help manufacturers maintain process windows, improve yield, and reduce costly rework. Find us at Booth 5949 for the latest advancements for semiconductor and advanced packaging applications during SEMICON West 2025.
