What’s Fueling Advanced Packaging’s Rise?

What’s Fueling Advanced Packaging’s Rise?

Want to learn more about why advanced packaging is seeing the most explosive growth yet since it first arrived on the scene? This informative webinar, hosted by Henkel, will feature insights from analyst firm YOLE Group about advanced packaging application drivers, emerging device complexity challenges, and future technology projections.

Henkel market and technical specialists will present details about demanding 2.5D and 3D advanced packages and the markets – like AI and HPC – that make more capable materials a necessity. Check out all the details and register below. Hope to see you on May 20th!

Expert Speakers:

Gabriela Pereira
Technology & Market Analyst
Yole Group

Raj Peddi
Market Strategy Manager

Kail Shim
Application Engineering Manager

Register Now

West: May 20 - 10 am PST
APAC: May 23 - 1 pm SGT
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