Since 1934, Indium Corporation has been a materials science innovator fueled by curiosity. Today, we are an industry leader in developing semiconductor and advanced assembly materials designed to enable semiconductor chips to communicate with the outside world.
These innovative products are used to manufacture mobile devices, tablets, computer games, automotive electronics, avionics, server farms, and power handling for renewable energy sources.

Our line of SiPaste® solder for fine feature printing and no-clean, ultra-low residue fluxes have become industry standards in semiconductor packaging and assembly. Here are just a few of our recent award-winning innovations: 
NC-809
This first-of-its-kind, industry-leading, no-clean, ultra-low residue, flip-chip, and ball-attach flux is ideal for many semiconductor applications.
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SiPaste® C201HF
This proven SiPaste® is formulated for fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency. 
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90 Years of Innovation
We are as proud of our rich legacy as we are of our cutting-edge materials of tomorrow. Check out our company timeline for an overview of our history of innovation through the decades.
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