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Since 1934, Indium Corporation has been a materials science innovator fueled by curiosity. Today, we are an industry leader in developing semiconductor and advanced assembly materials designed to enable semiconductor chips to communicate with the outside world.
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These innovative products are used to manufacture mobile devices, tablets, computer games, automotive electronics, avionics, server farms, and power handling for renewable energy sources.
Our line of SiPaste® solder for fine feature printing and no-clean, ultra-low residue fluxes have become industry standards in semiconductor packaging and assembly. Here are just a few of our recent award-winning innovations:
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NC-809
This first-of-its-kind, industry-leading, no-clean, ultra-low residue, flip-chip, and ball-attach flux is ideal for many semiconductor applications.
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SiPaste® C201HF
This proven SiPaste® is formulated for fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency.
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6 Liberty Square #2040, Boston MA 02109 USA
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