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Rochester offers a range of Semiconductor Manufacturing options from Individual Services through to full Turnkey Solutions
Rochester Enhances Assembly Capability with Copper Wire Bonding
Our Engineering team has recently expanded Rochester Electronics semiconductor assembly capabilities to facilitate copper wire bonding.
Copper Wirebonding refers to the wire bonding process that employs copper wires for semiconductor interconnection, instead of the gold or aluminum wires traditionally used in semiconductor packaging.
Copper is rapidly gaining a foothold as an interconnection material in semiconductor packaging because of multiple advantages over gold and aluminum. These advantages include:
- Significant cost reduction
- Superior electrical and thermal conductivity
- Higher mechanical stability
Copper is inherently 3 to 10 times cheaper than gold, so substituting gold wires with copper wires can realize significant annual cost savings.
Copper wire is more electrically conductive by about 25%-30% than gold, which has a resistivity of 0.022 micro-ohm-m at room temperature. This low electrical resistivity of copper results in better electrical performance. Copper wire is a preferred bonding wire material for high-current or high-power applications since it can carry more current for given wire diameters.
Studies have shown that copper wire can achieve greater mechanical stability than gold wire. Standard bond strength tests such as the wire pull test and the ball shear test have demonstrated that copper ball bonds exhibit 25%-30% higher readings than comparable gold ball bonds.
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Rochester Qualifies New Hermetic Packages
Rochester has qualified a number of Ceramic Quad Flat Pack (CQFP), Ceramic Pin Grid Array (CPGA), and Ceramic Dual In-Line (CDIP) packages to add to our portfolio of hermetic package assemblies.
In addition to hermetic package assembly, we offer a range of assembly services including:
- Die Processing (dicing, wafer back-grind, and much more)
- Die Attach
- Wirebond
- Cap Sealing
- Laser and Ink Marking
- Component Lead Finishing (Matte Tin, Tin-Lead)
View our full line of qualified hermetic packages
Watch this video to learn more about our Component Lead Finishing services
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Extending the Product Lifecycle of End-of-Life SiGe Components with Plastic Assembly and Test Services
A valued Rochester Electronics’ supplier partner decided to move one of their high-speed Clock Generator devices to end-of-life (EOL) while the device remained in use across multiple industry applications. End customers needed to establish a continued long-term source of supply.
Learn how we were able to provide support by providing Pick and Place services from SiGe wafers, Quad Flat No Lead (QFN) plastic assembly, and RF Test verification to ensure full performance and full reliability testing.
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Technical Paper: The Effects of Long-Term Storage on Mechanical Integrity and Electrical Performance of Semiconductor Components
In today’s semiconductor industry of limited capacity, many Original Component Manufacturers (OCMs) are moving to shorter product lifecycles. However, multiple industries require equipment to be operational and maintained for many decades. Therefore, ongoing component supply is critical to sustaining these applications throughout their useful lifecycle.
Storing semiconductor components for extended periods of time after final production is one widely practiced solution. Since 1981, Rochester Electronics has been successfully practicing prolonged component storage to bridge supply chain disruptions for long-life applications.
When long-term component storage is used, it is important for end-users to have confidence that the components are reliable in the field.
This paper examines the long-term storage effects on mechanical integrity and electrical performance. A random sample of components, spanning a variety of package styles and stored for periods up to 17 years, were inspected and analyzed to determine the effects of aging. Extensive testing based on optical, X-ray, and SEM imaging, decapsulation, cross-sectional inspection, and electrical testing indicated no negative results or failures.
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Rochester Webinar: Extending Semiconductor Component Lifecycles for Critical Military and Aerospace Applications
- Date: Tuesday, August 9, 2022
- Time: 11:00 AM ET / 5:00 PM CEST
In today’s consumer electronics market many products have a limited shelf life and likewise, the semiconductor components that drive these items have short lifecycles. However, the Aerospace and Defense industries have applications that may require semiconductor components to have a lifecycle of 20-30 years. Join our technical expert to learn about the options available to extend semiconductor component product lifecycles, delay obsolescence, and the various services and solutions available to support you.
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Rochester Electronics LLC
16 Malcolm Hoyt Drive, Newburyport, Massachusetts 01950
United States 978.462.9332
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