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Rochester offers a range of Semiconductor Manufacturing options from Individual Services through to full Turnkey Solutions
Wafer Storage and Die Processing Services
Offering a range of services including Long-Term storage, Dicing, Back-grind, Inspection, Pick and Place to extend product lifecycle.
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Component Lead Finishing: In-house solutions for performance critical applications
Leadframe-based semiconductor packages still play an important role in today's semiconductor industry. To prevent the growth of "Tin Whiskers" which can cause electrical shorts and damage the equipment that incorporates these components, Rochester offers SnPb (Tin-Lead) and Matte Tin solder dipping and lead plating services. We also provide conversion services from RoHS to Tin-Lead.
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Plastic Dual Inline Package Assembly Services for Long lifecycle Applications
Our plastic assembly line offers a range of PDIP packages to support long life cycle applications that may be facing obsolescence. Our services also include wafer storage and die processing.
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Technical Paper: The Effects of Long-Term Storage on Solderability of Components
As with any items that have been in storage for long periods of time, quality and reliability are key concerns. But what is a safe Shelf Life for semiconductor components? To determine the quality of aged semiconductor components in real-world applications, we performed an analysis on solderability by using an industry-standard board mount with solder paste and reflow manufacturing process.
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Custom Hybrid Assembly Services Keep Your Business Moving
Hybrid Module assembly services per MIL-PRF-28534 and MIL-STD-883 with a range of manufacturing services, including die attach, wire bond, and SnPB finishing at our US-based in-house facility. Broad range of qualified hermetic packages available, as well as the ability to do many custom offerings.
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A Continuous Source for Critical Processors
Read this Rochester Electronics' case study to learn how we worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
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