It is now possible for designers to achieve greater productivity and system-level optimization with the Integrity™ 3D-IC platform, the industry’s first integrated 3D-IC platform that enables design planning, implementation, and early system analysis in a single, unified cockpit.

Key benefits to help you get to market faster:

✓	Productivity: Engineers can plan and build multiple chiplets in a unified environment simultaneously with a multi-technology database
✓	Design Robustness: Integrated electrothermal and physical checks to ensure reliability
✓	System-Driven PPA: Early feedback from system-level analysis to improve chip-level power, performance, and area
✓	Ease of Use: Single planning cockpit and hierarchical database allows interactive flow management and results analysis

For more information, visit our product page or contact us with any questions.