It is now possible for designers to achieve greater productivity and system-level optimization with the Integrity™ 3D-IC platform, the industry’s first integrated 3D-IC platform that enables design planning, implementation, and early system analysis in a single, unified cockpit.

Key benefits to help you get to market faster:


Productivity: Engineers can plan and build multiple chiplets in a unified environment simultaneously with a multi-technology database


Design Robustness: Integrated electrothermal and physical checks to ensure reliability


System-Driven PPA: Early feedback from system-level analysis to improve chip-level power, performance, and area


Ease of Use: Single planning cockpit and hierarchical database allows interactive flow management and results analysis

Watch the Launch Video to Learn More

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For more information, visit our product page or contact us with any questions.

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