Advanced Packaging and Wafer Level Inspection & Metrology

Fast, 100% Metrology and Inspection with WX3000™ Systems

Powered by the NanoResolution Multi-Reflection Suppression™ (MRS™) Sensor, the WX3000 3D and 2D enabled system provides the ultimate combination of high speed, high resolution and high accuracy to improve yields and productivity. Increase throughput with speeds 2-3X faster than alternate technologies. Conduct 100% 3D and 2D metrology and inspection for features as small as 25-micron in a single pass, versus multiple separate scans and sampling-only methods.

Check out our videos, case studies and white papers to see how the WX3000 system with the NanoResolution MRS Sensor help improve yields and processes for wafer-level and advanced packaging applications.

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