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Seriously Fast | 2-3X Faster with High Resolution and Accuracy
WX3000™ Metrology and Inspection Software Features
Powered by Multi-Reflection Suppression™ (MRS™) Sensor Technology, the WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy to improve yields and productivity. Our spotlight video looks at some the software features that enable 100% 3D and 2D measurement in one pass to detect defects and critical packaging features for a wide range of wafer-level and advanced packaging applications.
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Ultimate Combination of High Speed, High Resolution
and High Accuracy with Proprietary
Multi-Reflection Suppression (MRS) Sensor Technology
Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT and semiconductor markets to improve yields and processes. For wafer-level and advanced packaging metrology and inspection, the 3-micron NanoResolution MRS sensor (X/Y resolution of 3 micron, Z resolution of 50 nanometer) enables metrology grade accuracy with superior inspection performance for features as small as 25-micron.
Check out our videos, case studies and white papers to learn more about MRS Technology and the NanoResolution MRS sensor.
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