Sub-Micron Die Bonders
Your Equipment Pathway for R&D to Prototype to Production


Technology transfer (process and tools) between machines
Our NEW solution for photonics manufacturing and more
FINEPLACER® femtoblu -- an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability. Synchronized control of all process parameters and automated alignment of substrates and components.
Advanced packaging R&D and prototyping
FINEPLACER® lambda 2 -- precision die bonder with 0.5 µm accuracy shares a common module range and operating software with Finetech's automatic systems to ensure a seamless process migration to series production.
Flexible assembly for production environments
FINEPLACER® femto 2 -- a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments. The modular design allows individual configurations.
Process flexibility in one platform.
Be prepared now and ready for future needs.
  • Thermocompression
  • Thermosonic
  • Flip Chip
  • Epoxy
  • Au/Sn Soldering
  • Die Attach
  • Sintering
  • UV Cure

Learn more about our machine specifications and equipment pathway.

Our demonstration labs are located in:

Mesa, AZ 480.893.1630
Amherst, NH 603.627.8989

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