|
|
|
Sub-Micron Die Bonders
Your Equipment Pathway for R&D to Prototype to Production
Technology transfer (process and tools) between machines
|
|
Our NEW solution for photonics manufacturing and more
FINEPLACER® femtoblu -- an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability.
Synchronized control of all process parameters and automated alignment of substrates and components.
|
|
Advanced packaging R&D and prototyping
FINEPLACER® lambda 2 -- precision die bonder with 0.5 µm accuracy shares a common module range and operating software with Finetech's automatic systems to ensure a seamless process migration to series production.
|
|
Flexible assembly for production environments
FINEPLACER® femto 2 -- a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.
The modular design allows individual configurations.
|
Process flexibility in one platform.
Be prepared now and ready for future needs.
- Thermocompression
- Thermosonic
- Flip Chip
- Epoxy
- Au/Sn Soldering
- Die Attach
- Sintering
- UV Cure
Learn more about our machine specifications and equipment pathway.
Our demonstration labs are located in:
Mesa, AZ 480.893.1630
Amherst, NH 603.627.8989
This email was sent to *|EMAIL|* - Unsubscribe.
Circuitnet Media, LLC | 6 Liberty Square #2040, Boston MA 02109 USA
|
|
|
