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Dr. Subodh Kulkarni, President and CEO, CyberOptics, sits down for a Q&A to discuss the wafer-level and advanced packaging market dynamics and how the WX3000™ 3D/2D metrology and inspection system provides a unique combination of high resolution, high accuracy and high speed (2-3X faster than alternative solutions) for 100% inspection to improve yields and productivity.
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Powered by Multi-Reflection Suppression™ (MRS™) Sensor Technology, the WX3000 3D/2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and processes. The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.
Visit our website to learn more about the WX3000 and check out some of our videos, case studies and white papers.
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