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The WX3000™, powered by the NanoResolution Multi-Reflection Suppression™ (MRS™) sensor, inspects shiny or mirror-like surfaces with sub-micrometer accuracy for features as small as 25µm.
Provides superior 100% 3D/2D inspection performance for attaining repeatable and reproducible measurements 2-3X faster than alternative technologies -- with throughput greater than 25 wafers (300mm) per hour. Ideal for solder ball and bumps, wafer bumps, and copper pillars.
Learn more about the WX3000 and NanoResolution MRS sensor. Read our white paper or watch our recent video.
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As presented during Semicon Taiwan 2020. Mr. Tim Skunes, VP R&D, CyberOptics, discusses the importance of 100% wafer bump metrology and inspection and how the NanoResolution Multi-Reflection Suppression (MRS) Sensor delivers precise 3D inspection and measurement for advanced semiconductor packaging applications.
Watch the presentation and view the white paper today.
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