With our industry-leading vacuum cure systems, YES keeps it cool to meet the lower thermal budget required by “Beyond Moore” advanced packaging. Reduce stress/warpage in 3D stacks. Leverage the all-copper interconnect trend. YES supports your move to low-temp technology with unrivalled film quality, excellent yield and superior throughput. Wafer or panel, R&D lab or high-volume manufacturing – we’ve got you covered.

Visit our virtual booth at Semicon West. See how our PB Series of manual cure systems and our flagship VertaCure XP automated high-volume system can take the temperature down, to accelerate your technology roadmap.

PB Series: Manual system
for polyimide vacuum cure

VertaCure XP: High-volume automated
system for polyimide vacuum cure

Clean. Coat. Cure.
www.yieldengineering.com
+1-510-954-6889 (main)
888-937-3637 (US toll-free)