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Thermosonic, High-Speed Wire Bonder
Palomar’s 8000i wire bonder is a thermosonic, high-speed ball-and-stitch fine wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profile. Its patented Dual Z-Axis bond head enables very reliable deep access wire bond performance. The 8000i is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices and is an excellent choice for optoeletronic packaging, LEDs and automotive assemblies.
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Placement Accuracy: +/- 2.5μm, 3σ placement repeatability
Patented Dual Z-Axis: Unique bond-head motion; Zr (rotary), Zl (Linear). 20mm deep access allows the formation ofprecise gold ball bumps. Patent # 6,102,275
Bond Data Miner™: A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring for increased yields and predictive maintenance.
VisionPilot® with Radar Referencing®: Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. |
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Applications:
• Large complex hybrids
• HB/HP LED arrays
• Optoelectronic packaging
• Chip-on-board (COB)
• System in packages (SiPs)
• Specialty lead frames
• Automotive assemblies
• Flex circuits
• Multi-chip modules (MCMs)
• Fine pitch devices
• LEDs with running stitch
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Tell us about your
application challenge:
Palomar 8000i datasheet
Call: 1-800-854-3467
Palomar Technologies
2728 Loker Ave. West
Carlsbad, CA 92010
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