The Palomar 3880 Die Bonder component placement die attach system with integrated Z-Theta bidirectional 8-tool bond head, makes it the fastest, most reliable multiple die bonder on the market.
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The Most Flexible Die Bonding System
The Palomar 3880 Die Bonder component placement die attach system features a state-of-the-art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the Palomar 3880’s versitility includes both eutectic and epoxy die attach, flip chip, as well as a range of options in a single machine
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Accurate: 5 μm placement accuracy with true radial position depending on the application, plus 0.1 μm linear XY encoders, and direct measure 0.00023 degree rotary encoder.
Consistent: 3.5μm, 3σ placement repeatability and 0.00361 degree, 3σ planar repeatability.
Flexible: Large 914.4 x 508.0 mm (36 x 20 inch) work envelope capable of handling many different part types, presentation options, and applications including epoxy and eutectic die attach.
Fast: Change tools on-the-fly with bi-directional turret.
Clear Vision: Process camera view provides real-time visibility while VisionPilot® provides the capability to find a die in any orientation and place it correctly |
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Applications:
• AOC - Active Optical Cable
• RF GaN/GaAs
• RF packages HB/HP LED assembly
• Microwave modules
• Hybrid microcircuits
• VCSEL, Photo Diode, DFB laser, and Lens attach
• Solid State Lasers
• MEMS
• RF Power Amplifier
• MOEMS |
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Double-pick process protected under US Patent 6,776,327.
Get more information today: Download
Palomar 3880 datasheet
Call: 1-800-854-3467
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