Learn More about Simplified New Approaches to High Thermal Die Attach

Join distinguished industry experts Jan Vardaman of TechSearch International and Davy Nakada of Henkel Corporation for a discussion about the market conditions driving a new approach to high thermal conductive die attach materials and processes.

Increases in the demand for high-performance power devices have underscored the need for better thermal control at the die level. This, combined with impending environmental legislation and the challenging processes associated with current materials, has accelerated the requirement for an easily-processed, effective die attach solution for managing the heat generated at the die level. Register now to secure your spot and improve your competitive advantage by being among those in the know.


Wednesday, August 22, 2018

9:00 AM � 10:00 AM PDT


Henkel Electronics

Learn more about our comprehensive portfolio of electronic materials.

Learn More

Have a Question?

Contact our experts for technical questions, product recommendations, and more.

Contact Us

Copyright 2018 Henkel Corporation
All rights reserved.

Henkel Corporation
14000 Jamboree Road, Irvine, CA 92606 USA

All marks are trademarks and/or registered trademarks
of Henkel and its affiliates in the U.S. and elsewhere.

This email was sent to *|EMAIL|* - Unsubscribe.
Circuitnet Media, LLC
6 Liberty Square #2040, Boston MA 02109 USA