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Void Free Temporary Wafer Bonding

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Dynatex International has developed a Void Free Wafer Bonding process.

Void free bonding is critical for: Wafer Thinning, Wafer Dicing and the Deep Reaction Ion Etch process.

These bonds are also low Total Thickness Variation (TTV).

Void free bonding is made possible by sequencing the heating, vacuum and pressure.

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The image to the right is of a void free wafer bond viewed through a glass substrate.

The DXB-880 wafer bonder automates the process thereby eliminating operator error.

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The bonds are made with WaferGrip Temporary Adhesive in conjunction with the DXB-880 Void Free Wafer Bonder.

Click this link for more information DXB-880

Come see us at the Sonoma IMAPS June 27-29

Visit www.dynatex.com, or e-mail jtyler@dynatex.com or call John Tyler at 707 542 4269 X233