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Viewpoint | ||
January 22, 2025
VIEWPOINT 2025: Matt Hansen, VP, Sales and Marketing, QP Technologies
We further expanded our capabilities this year, adding a new, fully automated high-precision dicing saw to our manufacturing line, enabling faster throughput for up to 300mm wafers. Key markets such as aerospace and defense are core demand drivers for our offerings, particularly for leaded plastic (lead-frame packages), open-cavity plastic (OCPP), and our own open-molded plastic (OmPP) package technologies. We expect demand to remain strong as military-aerospace applications continue to require a broad range of IC assembly solutions using our robust product portfolio. Demand for custom substrates, particularly organics, also continues to escalate due to the materials’ efficiencies and cost-effectiveness for high-speed, high-performance devices, such as power semiconductors and chips for high-frequency devices. Our expertise in these applications is enabling rapid expansion of our business, as the demand for back-end semiconductor applications remains strong. Matt Hansen, VP, Sales and Marketing QP Technologies http://www.qptechnologies.com |
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