Viewpoint
January 22, 2025

VIEWPOINT 2025: Matt Hansen, VP, Sales and Marketing, QP Technologies



VIEWPOINT 2025: Matt Hansen, VP, Sales and Marketing, QP Technologies
Matt Hansen, VP, Sales and Marketing, QP Technologies
In 2024, QP Technologies' benefited from strong growth in the semiconductor industry. According to market analyst firm TechInsights, "IC demand is poised for a significant surge in 2025, leading to an urgent need for increased manufacturing capacity." As such, we expect demand to remain high for our core technologies, including fast-turn IC packaging and assembly, advanced assembly services (stacked die, flip-chip, SIP, etc.) and back-end wafer processing.

We further expanded our capabilities this year, adding a new, fully automated high-precision dicing saw to our manufacturing line, enabling faster throughput for up to 300mm wafers.

Key markets such as aerospace and defense are core demand drivers for our offerings, particularly for leaded plastic (lead-frame packages), open-cavity plastic (OCPP), and our own open-molded plastic (OmPP) package technologies. We expect demand to remain strong as military-aerospace applications continue to require a broad range of IC assembly solutions using our robust product portfolio.

Demand for custom substrates, particularly organics, also continues to escalate due to the materials’ efficiencies and cost-effectiveness for high-speed, high-performance devices, such as power semiconductors and chips for high-frequency devices. Our expertise in these applications is enabling rapid expansion of our business, as the demand for back-end semiconductor applications remains strong.

Matt Hansen, VP, Sales and Marketing
QP Technologies
http://www.qptechnologies.com
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