|
|
Viewpoint | ||
January 31, 2025
VIEWPOINT 2025: Dan Trojan, CEO, Axus Technology
Looking at silicon carbide (SiC) substrates and devices, while this market was projected to grow continuously and significantly in 2024, a number of factors contributed to materially slower growth than was anticipated, particularly in H2. We see strong indicators of a significant rebound in 2025 – again, particularly in H2. Key contributing trends include further development of advanced packaging technologies and techniques for smaller, more compact and powerful devices, and the impending transition from 150mm to 200mm SiC wafers. We contribute to the thermal management essential to these trends with our in-situ process temperature control technology. As the feasibility and probability of new materials and applications continuing to scale to larger substrate sizes, including 300mm SiC, become clearer, we recognize the need for further technological advancements to better enable such scaling. Axus Technology will continue on our innovation path to maintain our leadership position during this evolution. Dan Trojan, CEO Axus Technology http://www.axustech.com |
We search for industry news so you don't need to. | ||
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|