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| Viewpoint | ||
February 9, 2022
VIEWPOINT 2022: Bob LePage, Marketing Manager, Circuit Technology Center
We completed a major expansion of our factory, which doubled our size to over 22,000 square feet. Additional capital equipment was brought on stream in 2021 including a second robotic hot solder dip system to support our component tinning services and BGA component re-balling department, a state of the art Oxford 980 X-Strata series XRF (x-ray fluorescence) system, and we added our seventh Air-Vac DRS25 hot gas rework system to support BGA component rework requirements. Component-level tinning services demand continues to grow; two additional robotic hot solder dip machines were ordered in 2021, with delivery and commissioning of these machines expected in January of 2022. While the industry wide component shortage problem stalled some customer projects, we saw a surge of customers interested in utilizing our services for component harvest and salvage projects. Thousands of BGA's, QFN's, QFP's and other hard-to-source components were successfully salvaged from assembled circuit boards, re-conditioned and re-packaged for our customers. We expect demand for these services to continue into 2022 as component shortages are forecast to extend well into the new year; fortunately Circuit Technology Center is well positioned to support our customers for this demand. After nearly 40 years, we are still here, we are still staffed with the industry's best, and we are still proud to demonstrate what we can do to help you and your company in these demanding and challenging times. Bob LePage, Marketing Manager Circuit Technology Center http://www.circuitrework.com |
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