Viewpoint - Jozef Vincenc Oboňa
January 21, 2022

VIEWPOINT 2022: Jozef Vincenc Oboňa, Product Marketing Director, Semiconductors, TESCAN ORSAY HOLDING



VIEWPOINT 2022: Jozef Vincenc Oboňa, Product Marketing Director, Semiconductors, TESCAN ORSAY HOLDING
Jozef Vincenc Oboňa, Product Marketing Director, Semiconductors, TESCAN ORSAY HOLDING
The industry is seeing rapid adoption of heterogeneous integration processes that embed multiple dies and other components in a single package. The primary challenge is simply one of scale.

While traditional packages might require the removal of thousands or tens of thousands of cubic micrometers of material to reach the suspect feature, heterogenous packages may require cubic millimeters -- that's billions of cubic micrometers.

Focused ion beam instruments (FIB) can cut cross sections with nanometer scale precision, but the cutting process is slow for the large volume tasks. Laser ablation can remove a cubic millimeter of material in a little more than 5 minutes, while still preserving micrometer scale cutting precision. Hybrid systems use the laser to remove the bulk of the material and FIB for final cross-sectioning. For large, high quality cross sections, calculated time savings compared to preparation with Plasma FIB alone range from 70% to 95%.

Systems that embed the laser ablation capability within the FIB system are inherently inefficient since only one capability can be used at a time. The latest technology increases throughput and productivity by allowing parallel processing in stand-alone laser ablation and FIB tools. The tools are integrated through correlative image alignment procedures and CAD overlay navigation.

In the parallel configuration, a single laser ablation system can feed multiple FIBs and other FA tools. This approach has the additional advantage of eliminating the risk of contaminating the FIB system where contaminants can interfere with imaging and analysis, even with load-lock integrated solutions.

I expect hybrid laser/FIB tools to become an integral part of analytical workflows in the semiconductor industry.

Jozef Vincenc Oboňa, Product Marketing Director, Semiconductors
TESCAN ORSAY HOLDING
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