| Viewpoint |
January 29, 2021
VIEWPOINT 2021: Varun Singh, Product Line Manager, Carrier Solutions, Corning Incorporated
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Varun Singh, Product Line Manager, Carrier Solutions, Corning Incorporated
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With the trend of thinner, more compact devices, wafers of different semiconductor materials from the front-end-of-line (FEOL) often need to be back-grinded to a thickness of <100 um and packaged using technologies such as heterogenous integration. For such applications, glass as a carrier can provide stiff support for wafer processing.
Moreover, these applications involve processing that happens at elevated temperatures, e.g., metal or dielectric deposition. Differences in the coefficient of thermal expansion (CTE) of the carrier and that of the device wafer can cause the bonded structure to warp, resulting in undesirable consequences such as lithography errors or even wafer breakage.
To support the trend of heterogenous packaging and the miniaturization of chips, Corning launched Advanced Packaging Carriers (APC) in 2019. Our APC product has high stiffness properties and a wide CTE range from 4.9ppm/C – 12.6ppm/C that can help match the CTE of the device wafer and reduce warp. With our rich product portfolio and short delivery time, Corning is positioned to support customers from product development all the way to mass production.
Varun Singh, Product Line Manager, Carrier Solutions
Corning Incorporated
http://www.corning.com
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