|Viewpoint - Glenn Farris|
February 18, 2020
VIEWPOINT 2020: Glenn Farris, Vice President, Marketing, Universal Instruments
After a difficult year in 2019, the semiconductor and equipment industries are experiencing a strong upturn, with advanced packaging technologies a significant beneficiary of the markets strength. 5G, AI, Edge Computing, Persistent Memory, Integrated Power Management are all driving the need for innovative packaging solutions which integrate silicon produced with disparate process nodes and deliver maximum performance at optimal cost.
Heterogenous Integration, utilizing a multitude of interconnect methodologies (from Fan-out to Silicon Interposer, to Chiplet), addresses this challenge but requires unique solutions for efficient, cost effective die placement. High speed, high precision multi-die placement, directly and efficiently extracted from a range of different sized wafers, is critical to enable cost effective assembly.
Universal has been deploying solutions for efficient and cost effective multi-die placement for over a decade. Working with industry leaders, we are dedicated to further expand our innovative offerings for this market in 2020.
Glenn Farris, Vice President, Marketing
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