VIEWPOINT 2020: Yann Guillou, Global Marketing & Sales Director, Trymax Semiconductor Equipment B.V.

Yann Guillou, Global Marketing & Sales Director, Trymax Semiconductor Equipment B.V.

Plasma equipment solutions for Wafer Level Packaging manufacturers have been representing a significant stream of revenues for Trymax for many years. As an example, half of the top 10 OSATs and many large IDMs are using Trymax's solutions to perform various PR, PI, PbO, BCB etch or descum steps and different types of surface preparations.

But looking forward, what to expect for 2020 in the Advanced Packaging world?

We believe China will be again very dynamic. As a European equipment company with local footprint in the region, we did not suffer from the US/China trade tensions but benefited from it. 2019 was the best year ever for us in China and many of our customers, including the ones engaged in 2019, have aggressive plans to ramp in volume in 2020.

Speaking about our products, we will be introducing innovative solutions, keeping in mind to offer the best cost of ownership for our customers. To name a few, we will release a low temperature / low damage plasma processing chamber, new handling solutions to process TAIKO wafers or wafers on film frames, and introduce UV curing in advanced packaging. These announcements and more will come along the year.

Finally, looking at the market, second half of 2019 year showed improvements and we expect them to continue in 2020. Some delays might still appear on the journey but the horizon for More than Moore applications is brighter than ever.

Yann Guillou, Global Marketing & Sales Director
Trymax Semiconductor Equipment B.V.
http://www.trymax-semiconductor.com

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