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| Viewpoint | ||
February 3, 2020
VIEWPOINT 2020: Kim Arnold, Executive Director of Wafer-Level Packaging Materials, Brewer Science, Inc.
As we enter 2020, the China tariff dispute continues to be an issue for most companies in the semiconductor industry. We have seen two key areas where the tariffs have affected materials suppliers: 1. China is a growing market for packaging and other back-end processes, and 2. The tariff is having a big impact on the material suppliers’ customers, which then creates downhill problems for the suppliers themselves. Brewer Science has positioned itself over the last couple of years to overcome these issues by improving our customer relationships. One of those areas is our diligence and focus on quality and customer service. By improving our quality-control processes and equipment sets, we have begun to work toward a 'zero-defect' program that will not only improve our materials but also the environment as a whole. In 2020, Brewer Science plans to have several new product launches that look to diversify within our current markets as well as new markets. Brewer Science continues to create and design new materials to improve front-end lithography processes. For example, we have a material for area-selective deposition or selective surface modification (SSM) that is having success in both front-end and back-end processes. As we continue to improve our portfolio for advanced packaging, we also expect to continue improving our temporary bonding/debonding materials, but we are also moving to offer materials that are good for permanent bonding applications. A third area of focus is growing our printed electronics expertise into new markets for monitoring of limited resources, such as water and energy. As we grow our portfolio in 2020, we look to see a large impact on growth for the semiconductor industry in 2020 vs 2019. Markets such as 5G, automotive, and power will be taking major technological and commercialization steps for growth overall. Memory will be looking to come back from its oversupply in 2018 and level out in 2020 and will also provide growth opportunities for the industry. Kim Arnold, Executive Director of Wafer-Level Packaging Materials Brewer Science, Inc. http://www.brewerscience.com |
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