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| Viewpoint | ||
January 30, 2020
VIEWPOINT 2020: Lena Nicolaides, Sr. V.P. and General Manager, KLA Corporation
Increasingly sophisticated heterogeneous integration schemes will be enablers for the semiconductor industry, providing the ability to tailor overall package performance, form factor, power consumption and cost. In 2020, this should lead to wider deployment of high-density fan-out packages and innovative 3D stacking technologies. KLA will continue to focus our technology innovation on solving our packaging manufacturers' challenging problems. These challenges drive requirements for highly innovative process control solutions. We will continue to build upon our front end inspection and metrology leadership to develop products that are optimized for advanced packaging applications. As the packaging industry turns to front end-like processes to scale interconnect dimensions and enable integration, our solutions are ready, with extended performance along key vectors of resolution, accuracy and productivity. KLA is excited for the 2020 prospect of growth for semiconductor advanced packaging and will continue to provide the high value inspection and metrology solutions required for successful packaging innovation. Lena Nicolaides, Sr. Vice President and General Manager KLA Corporation http://www.kla.com |
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