|Viewpoint - Ram Trichur|
January 29, 2020
VIEWPOINT 2020: Ram Trichur, Global Market Segment Head, Henkel Corporation
While 2019 saw year-over-year contraction, forecasts from industry analysts and Henkel customers suggest that 2020 will produce solid gains across semiconductor packaging applications. This is largely driven by 5G telecom and mobile electronics, and by some specific growth areas within the automotive/industrial and datacenter/memory sectors.
In the 5G mobile communication market, Henkel is addressing miniaturization with unique solutions for EMI shielding to isolate RF signal interference, as well as enabling the growth of wafer-level packaging through innovative liquid compression molding and printed encapsulation materials that reduce warpage and raise throughput.
For 5G infrastructure technologies, where large, high performance data processors are required, protection of devices such as FCBGAs and the assurance of improved reliability are achieved with Henkel's lid attach materials and underfill innovations.
Finally, our material science expertise in the development of semi-sintering high thermal die attach materials is facilitating integration of increasing volumes of RF power amplifiers. In these areas and more, Henkel's semiconductor leadership and expansion of advanced packaging solutions are enabling our customers’ competitiveness and ability to quickly bring new products to market.
Ram Trichur, Global Market Segment Head, Semiconductor Packaging Materials,
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