|Viewpoint - Casey Krawiec|
January 3, 2020
VIEWPOINT 2020: Casey Krawiec, VP of Global Sales, StratEdge Corporation
StratEdge has introduced a line of packages specifically designed for the extreme demands of GaN devices, for which demand is expected to increase exponentially in 2020. The LL-series packages, combined with our proprietary eutectic die-attach services, reduce chip temperatures for improved efficiency and reliability of the devices. The result is improved performance of the device, with increased power output and longer life.
We're expecting to see the most growth in the telecom, mixed signal, broadband wireless, satellite, military, test and measurement, automotive, and MEMS markets. StratEdge provides numerous customers with novel packaging solutions to meet a variety of applications, including a line of hermetic high-frequency QFNs. Overall, we anticipate 2020 will be an "up" year for StratEdge, and likely the semiconductor packaging industry in general.
Casey Krawiec, Vice President of Global Sales
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