Exclusing Article
June 21, 2012

3D-IC Progress on Display at SEMICON West 2012

3D-IC Progress on Display at SEMICON West 2012
Denny McGuirk, President and CEO, SEMI
Given their potential for smaller form factors, increased performance, and reduced cost and power consumption, 3D-IC technologies are now enabling the next generation of advanced semiconductor packaging. Already, 2.5D technology using silicon interposers to provide wide IO bandwidth and denser packaging have been introduced, but multiple manufacturing and collaboration barriers remain to widespread commercialization.

While 3D integration using through-silicon vias (TSVs) promise a fundamental shift for current multi-chip integration and packaging approaches, cost-effective, high-volume manufacturing will be difficult to achieve without standardized equipment, materials, and processes.

Besides the technical hurdles of implementing complex, new technology in a cost effective way, 3D-IC technology presents unprecedented collaboration challenges among IDMs, foundries and OSATS, between diverse chip companies, and throughout a global supply chain.

3D-IC Progress on Display at SEMICON West 2012
Multiple paths and techniques for manufacturing 3D-IC products are emerging; which of these paths will prove most effective for various implementations has yet to be determined. Heterogeneous integration that puts memory, logic processors, and other devices all on one substrate, in a small form factor, is the long-term goal.

SEMICON West 2012 will feature a number of speakers, programs and exhibitors who will present diverse perspectives on 3D-IC implementation strategies. On Wednesday, July 11, the session entitled, "2.5 & 3D Packaging Landscape for 2015 and Beyond" will examine what the market and supply chain will need to look like to drive true volume production and adoption of recent advancements in 2.5D (interposer) and 3D packaging. Experts from Altera, Fujitsu Integrated Microtechnology, Georgia Institute of Technology, and HiSilicon Technologies will be among the speakers. John Lau, ITRI, and Bill Bottoms, 3MTS, will moderate the panel discussion.

3D-IC Progress on Display at SEMICON West 2012
The market for packaging materials are estimated to grow from $23.4 billion in 2011 to $23.9 billion in 2012, according to the Global Semiconductor Packaging Materials Outlook (SEMI/Techsearch International), Packaging materials as a percentage of total semiconductor revenues will also increase, as chipscale packaging (CSP), wafer-level packaging (WLP), other system-in-package (SiP) type technologies, and stacked-die and other 3-D packaging form factors, become more widespread.

To achieve the benefits of 3D integration, an unprecedented amount of industry collaboration will be required. To facilitate that development, 3D-IC Standards meetings will be held on Tuesday, July 10 to discuss current and future opportunities for industry-wide standards. Standards task force meetings will be held on Thin Wafer Handling, Bonded Wafer Stacks, and Inspection and Metrology. These activities are just a portion of what is currently a global, industry-wide effort. Over 125 technologists from industry, research institutes, and academia around the world have already joined the SEMI 3DS-IC Standards Committee and are at work on these critical standards.

3D-IC Progress on Display at SEMICON West 2012
Approximately 30,000 microelectronics professionals will attend SEMICON West from July 10-12, 2012 in San Francisco. Leading packaging equipment and materials companies will be participating in the exhibition and packaging and technology solutions will be featured in free TechXPOT sessions on the show floor.

The International Technology Roadmap for Semiconductors (ITRS) will also hold their annual public meetings at SEMICON West. On Thursday, July 12, ITRS Back End of Line Technologies working groups present the challenges for future interconnects, Through Silicon Vias (TSVs), the latest roadmaps for semiconductor assembly, and systems packaging applications.

In addition to 3D-IC and advanced packaging programs, on Tuesday, July 10, a free session entitled "Contemporary Packaging: Achieving Cost Advantage through Innovation" will delve into the growing complexity, growth and new cost-down solutions in established technologies, particularly in the analog, power and automotive spaces. The session will focus on the optimization of technologies such as cu wire bond, flip chip, large matrix format and advanced leadframe packages and features speakers from ASM Pacific Technology, Kulicke & Soffa, Texas Instruments and STATSChipPac.

For more information on SEMICON West 2012, please visit: www.semiconwest.org. To register, click here: http://www.semiconwest.org/Participate/RegisterNow.

Denny McGuirk , President and CEO
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