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ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
 For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
PacTech's Ultra-SB2 WLR
Volume Solder Ball Placement
 Wafer level solder ball rework system for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip WLSCP applications. Integrated 2D-Inspection and reflow. Learn more …
PacTech
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