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Die Bonding Made Easy
Precision X-Form Needles
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
PacTech's Ultra-SB
2
WLR
Volume Solder Ball Placement
Wafer level solder ball rework system for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip WLSCP applications. Integrated 2D-Inspection and reflow. Learn more
PacTech
User-Friendly Automatic Wire Bonders
Cost-effective just point, click, bond
Bonders for gold ball bonding, ball bumping and wedge bonding capable of bonding 17-75 micron diameter wire. Rapid changeover design allows package conversions in as little as 3 minutes and accommodates a multitude of device configurations. Learn more
Questar Products International
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