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  Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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Case Study & Application Note
How flat are your substrates?
Substrates White Paper Packaging coplanarity issues begin with the flatness of your substrates. Learn more…
Cyber Technologies
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PacTech's Low-Cost Wafer Bumping Services
Quick-turn prototyping and mass-production
PacTech's Low-Cost Wafer Bumping ServicesLow-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more…
PacTech


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