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Feb 2, 2017
VIEWPOINT 2017: Loofie Gutterman, President & Co-Founder, Marvin Test Solutions
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Marvin Test Solutions is looking forward to 2017 as a year of growth for our TS-900 semiconductor test solutions product line. The TS-900 family of testers continues to evolve and provides a cost-effective, small-footprint, open architecture alternative to "big iron" ATE. During the latter half of 2016, we added the TS-960e ...
Feb 1, 2017
VIEWPOINT 2017: Oren Saar, CEO, Micro Point Pro Ltd
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2016 was a fascinating year in the packaging market! We experienced more consolidations and unexpected growth while taking on new and challenging applications. The never-ending process of helping our customers increase yield and productivity continues to be our goal. A significant milestone ...
Jan 31, 2017
VIEWPOINT 2017: Sheri Martin, Sales Manager, YXLON FeinFocus
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2016 was an exciting year for YXLON FeinFocus. The introduction of the FF20 CT greatly improved our capabilities in assisting semiconductor companies with improving their time to market, and expanded our range of defect and material analysis. This new high-end computed tomography inspection system gives ...
Jan 30, 2017
VIEWPOINT 2017: Poupak Khodabandeh, Global Head, Semiconductor Packaging Materials Steering Unit, Henkel Electronics Materials, LLC
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The new growth leader for electronics is automotive and, in this sector, companies value reliability and stability -- not just in product performance, but also in supplier partners. With over 30 years of proven success in semiconductor materials innovation, experienced sales and technical service teams and a broad ...
Jan 27, 2017
VIEWPOINT 2017: Neil O'Brien, General Manager, Finetech
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Finetech enters 2017 following a very productive year, where we introduced two new systems to the market. Our sub-micron Sigma semi-automatic bonder and the Femto2 fully automated sub-micron bonder were well received. Both contain our new patented optics and touch screen pattern recognition interface. In ...
Jan 26, 2017
VIEWPOINT 2017: Cheam Tong Liang, V.P. Corporate Strategy, Kulicke & Soffa
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The semiconductor market growth in the last few years has been fueled primarily by smartphones and SSD. The smartphone and SSD has been pushing the envelope of the IC assembly and packaging technologies. This will continue in 2017. We should expect smartphone and SSD to continue to be the major contributors ...
Jan 25, 2017
VIEWPOINT 2017: Christopher L. Henderson, President, Semitracks Inc.
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2017 looks to be an okay year for the semiconductor industry. The last several years have been rather lackluster for our industry, but at Semitracks we're hopeful that we will see some growth this year. We're not predicting large growth, but we can see 5-10% if there aren't any exogenous shocks to the system. ...
Jan 24, 2017
VIEWPOINT 2017: Daniel Twitchen, Head of CVD Business Development, Element Six
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Demand for smaller, faster and more powerful electronics continues to drive growth and innovation in the semiconductor industry. Simultaneously, requirements such as increased bandwidth and speed in radio frequency and optical communications, combined with miniaturization, require new ...
Jan 19, 2017
VIEWPOINT 2017: Ricardo Fuentes, CEO/President, MATECH
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Something is different. It used to be that if you turned the crank; spent the money, did the homework; every year and a half or so, you had the rightful expectation of making some decent money. The markets were there and if you were first with the new the generation, your clients were waiting ...
Jan 19, 2017
VIEWPOINT 2017: David Butler, EVP and General Manager, SPTS Technologies
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FOWLP and other Wafer-level Packaging. "FOWLP first appeared in the late noughties and was used for PMIC and RF devices with modest line & space dimensions. It was also in relatively low volume production. 2016 was the year when fan-out wafer level packaging went mainstream when teardowns ...