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March 25, 2008
Phil Vere, Managing Director – Bond Testing, Dage Precision Industries
 Semiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ...
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February 4, 2008
Peter Biocca, Senior Market Development Engineer, Kester
 Year 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ...
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February 1, 2008
Dr. Aleksej M. Rodin, Via Team Leader, XSiL Ltd.
 Through-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ...
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January 31, 2008
Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems
 We see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ...
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January 30, 2008
John Wood, Systems Engineer, Plasma Etch, Inc.
 In our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ...
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January 29, 2008
Bruce S. Moloznik, VP Global Marketing, Cookson Electronics, Alpha
 In 2007, we observed a stabilization of lead-free penetration globally, but at different rates, regionally. We envision a more consistent level of lead-free conversion at current rates going through to 2008. In 2008 and beyond, we see an increasing trend toward further environmental focus by the ...
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January 28, 2008
Henry J. Klim, President, BMC
Our focus on companies in the Microsystems and MEMS space continues to allow BMC to grow vertically with expanded knowledge and capabilities within these application spaces, yielding significant commercial revenue and in-depth knowledge of these very complex packaging, assembly, and test problems. These commercial customers ...
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January 25, 2008
Stephen Brodeur, Program Director, Printer Division, Milara Inc.
 This past year Milara has introduced two new products to the surface mount and semiconductor industries. First was our new award-winning AWPb 300 fully automated wafer bumping system for the semiconductor market followed by our new SemiTouch STAV system for SMT. Milara and our new products were well ...
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January 24, 2008
Pat Trippel, President of Electronics Group, Henkel
 Without question, this past year has been full of milestones for Henkel – events and product developments that will undoubtedly enable our customers’ competitiveness. The acquisition of Accurus Scientific Company, Ltd., completed in Q4 of 2006, was very successful and the advanced solder sphere portfolio has ...
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January 23, 2008
Andy C Mackie, PhD, Product Manager, Indium Corporation
Jordan Ross, Marketing Manager, Indium Corporation
 In ball-attach fluxes, we are seeing increasing demand for no-clean materials, driven by the twin needs of process cost reduction and elimination of capital (cleaning) equipment costs. The customers of the primary OSAT (outsourced assembly and test) companies are beginning to accept that ...
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