Comments from industry executives on the past year and the year ahead.
Feb 3, 2015|
Werner Plotz, Head of Business Development, Muhlbauer Group
We stay in close communication with the OSATS as well as end customer to learn early about their needs and requirements. We continuously strive to discover new markets and provide innovative technologies in the high tech area. We will introduce a new high speed packaging process for Flip Chip LED Production, which significantly lowers the packaging cost for LEDs. This technology is derived from Mühlbauer's high speed Die Sorting- and R2R ...
Feb 2, 2015|
Karen Lynch, Senior Vice President of Sales & Marketing, SV TCL
At SV TCL we believe that our broad range of products and services, along with our expansive global infrastructure, will allow us to stand out among the crowd. Our probe card line is extensive and includes cantilever, vertical, fine pitch vertical and spring-pin for IC test applications such as high volume System on Chip (SOC), Microprocessors, Wafer Level Chip Scale Packages (WLCSP), 3D packages, Copper Pillar, Through Silicon Via (TSV) ...
Jan 30, 2015|
Jonathan Doan, Director of Marketing, Nordson MARCH
For the markets that Nordson MARCH serves, we see strong growth in wafer-level packaging (WLP), not only for chip-scale WLP (CS-WLP) but further up the semiconductor line where the wafers are thinned and singulated. Our customers are moving towards packaging when the wafer is still on the carrier or some film. Our new, thinned wafer plasma chamber was specifically developed for these customers. Nordson MARCH's core market of plasma prior ...
Jan 29, 2015|
Dr. Dev Gupta, CTO, APSTL
The wait for 3-d stacked Processor & Memory to appear in products is beginning to look more and more like "Waiting for Godot", Beckett's famous play! Back in the early 1990s it took only 3 years for a leading US based IDM to develop the now common electroplated solder bump flip chip technology and implement them into ASICs This lower cost version including Cu pedestals has now completely replaced IBM's original evaporated ...
Jan 28, 2015|
Joe Holt, Vice President Business Development, Integra Technologies LLC
We see 2015 shaping up to be another strong growth year for the semiconductor industry. For those of us in the test segment of the market, it means we will need to continue to add even more expert engineering capability and even more sophisticated test equipment to address the ever more complex devices today’s fabrication and packaging technologies enable. One of the unavoidable test industry side effects ...
Jan 27, 2015|
Amir Khoshniyati, Marketing/, Sage Analytical Lab
Sage Analytical Lab has been investing heavily into the latest and ground breaking equipment to service the semiconductor industry. We look forward to leveraging this modern machinery to provide quick-turn around and to help identify and analyze even the smallest of features. Sage Analytical Lab is growing quickly and looking for experts in analytical services for microelectronics failures. As a result of our fast-paced growth we have many ...
Jan 26, 2015|
Adrian Wilson, Director & Bruce Bolliger, Head of Sales and Marketing, Element Six Technologies
Element Six is in a unique position in that we derive our differentiation from diamond itself. We uniquely provide a range of thermal grades, sizes, thicknesses, and metalizations of diamond to help the industry solve its most challenging thermal management problems. Diamond is highly differentiated vs. other materials in its thermal properties, being up to five times more thermally conductive ...
Jan 23, 2015|
Gilles Poupon, Scientific Advisor, Advanced Packaging, CEA-Leti
For many years, Leti's differentiation has stemmed in part from the combination of research expertise and infrastructure designed to meet Leti's strategic goals and its partners' needs. Today, our capabilities enable us to develop new processes in 3D integration (3DIC, 3DTSV), silicon interposers (2.5D), and wafer level packaging for MEMS. We expect to see 3D applications head in two main directions in 2015. One is ...
Jan 22, 2015|
Frank Folmsbee, Sales Manager, Aries Electronics Inc.
At Aries, we anticipate that device manufacturers will continue to develop chips with smaller pitch. This is why we have developed a new spring probe capable of contacting devices with pitch as small as 0.2mm. These new probes enable socketing (for test and burn-in applications) for many new device packages and bare-die being designed and made on this pitch. The contact and spring material are gold plated beryllium-copper. The probes ...
Jan 21, 2015|
Neil O'Brien, General Manger, FINETECH
Finetech continues to offer the most precise device bonders in the market. We deliver sub-micron accuracy in a modular design not only in tabletop bonders, but also fully-automatic systems. R&D labs and engineers needing a true pathway to production see this value. Sub-micron precision is critical for the latest complex applications. When a technology change demands a new process solution, our base systems can be adapted. This is what we like ...