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  Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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5 Micron Placement Capable!
Small Footprint, Low Cost
Air-Vac Onyx500The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more…
Air-Vac Engineering




Die attach, flip chip placement, & SMT in one machine
CX-1The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more…
Juki Automation Systems
Viewpoint    Page 1 of 7  
March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
imageThroughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
imageIn all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
imageDriven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
image2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
imageThe ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
February 17, 2010
Jim Greig, Sales and Marketing Manager - Electronic Materials LORD Corporation
imageWith more than 40 years of experience developing silicone, epoxy and polyurethane electronic materials for potting, thick film and microelectronic applications, LORD Corporation has seen the market shift and change based on a variety of factors. According to Jim Greig, Sales and Marketing Manager - Electronic Materials LORD Corporation, the company sees many indications at this time that the industry is in an under-supply situation ...
February 15, 2010
Steve Lerner, CEO, Alchimer
image The evolution of chipmaking toward devices with smaller form factors, improved power consumption and lower costs has accelerated development of 3D integration technology. Recognition that through-silicon vias are an enabling technology for 3D integration has synchronized Alchimer's offering with industry requirements. Leading customers are asking for higher aspect ratio TSVs to preserve wafer real estate and maintain ...
February 10, 2010
Tim McNulty, CEO and President, Harbor Electronics, the board division of Multitest
imageWe prepared for 2010 by not slowing down in 2009. As the leader in the prototype PCB business for the semiconductor test market, we cannot afford to fall behind the technology curve or lose pace with our customers' requirements. We continued to engage with customers as part of their R&D pipeline, and continued to invest in new equipment, our people and our processes. Tighter capital expenditure budgets meant we had to scrutinize our ...
February 9, 2010
James Quinn, CEO, Replisaurus Technologies
imageAs a startup that is bringing a game-changing interconnect technology to market, Replisaurus has a good perspective on the leading edge of both the back-end and front-end sectors. And from what we're seeing, 2010 is shaping up as a very dynamic year. The investors we're speaking with have a refreshingly revived level of interest in the semiconductor area, and we're finding increasing interest in joint development projects at ...
February 8, 2010
Bob Sykes, CTO, XYZTEC
imageAlthough the market was slow in 2009, XYZTEC took the initiative to invest in long term projects, one of them being new products to address green technology, like solar, and semiconductor trends such as 3D and ever reducing geometry! In addition, we experienced a 30% increase in personnel; not common during a recession. These efforts provide the ...
Viewpoint    Page 1 of 7  


Preventing Solar Cell Micro Cracks
Solar Soldering Application Note
Preventing Solar Cell Micro CracksStringing and bussing soldering can cause thermal stress and micro cracking of solar cells. A process to prevent damage and produce 1-2µm inter-metallic bonds between ribbon and cells must be identified & maintained. Learn more…
OK International




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