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  White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
imageOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc. Advertisement
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BGA repair and engineering Solder Spheres
Any Quantity, Size or Alloy – Overnight
imageEasyspheres.com, exclusive distributor of Kester Ultraspheres, announces its new overnight delivery service. Spheres are available in most diameters, alloys, and quantities for BGA repair and engineering. Learn more…
EasySpheres Advertisement




Agilent Advanced NBTI/PBTI Solution
for the Agilent B1500A
imageComplete solution for ultra-fast NBTI and PBTI measurement. 1 µs current measurement capability enables accurate NBTI Vth degradation evaluation. Click here to learn more…
Agilent Technologies, Inc. Advertisement
Event Calendar    Page 1 of 8  
Trade shows, conventions, meetings, training sessions, etc. relating to semiconductor packaging.

Submit an Event.

Jul 23, 2008
REACH and Global RoHS Workshop
Foresite Systems would be very happy to provide you with a personalized Workshop/Demo for your company either Face to Face or by Webinar. ...
Foresite Systems
Jul 24, 2008
The Truth About MEMS--A MEMS Webinar
Just how fast is the MEMS industry really growing? There’s not much consensus, as evidenced by various market forecasts, which have the ...
iSuppli Corporation
Jul 28, 2008
ICEPT-HDP 2008
During last decade, the International Conference on Electronic Packaging Technology (ICEPT) and the International Symposium on High Density ...
ICEPT
Jul 28, 2008
2009 iNEMI Roadmap Workshop - Asia
Work is underway on the 2009 iNEMI Roadmap, and iNEMI is hosting a series of regional industry workshops this summer to review progress to date. ...
INEMI
Jul 30, 2008
Air Velocity Measurement in Electronics Design
Why should engineers measure air velocity inside a system? What tools will they need to obtain useful velocity measurements, and where ...
Q ATS
Jul 30, 2008
PVJapan 2008: A Total Photovoltaics Event
PVJapan 2008 is a new, comprehensive event dedicated to all aspects of Japan's exciting photovoltaics industry. With photovoltaic technology ...
PVJapan
Aug 3, 2008
Packaging Technology
Semiconductor Packaging Technology is a 2 day course that offers detailed instruction on the technology issues associated with today’s ...
Semitracks Inc.
Aug 3, 2008
ESD/Latchup Design and Technology
Electrostatic discharge is a 4 Billion (USD) a year problem for the Semiconductor Industry. This problem is likely to grow in the future as smaller devices are susceptible to damage at lower static voltages and latchup under more subtle conditions. Today, circuit designers and process integration engineers require a fundamental knowledge of device physics and electrothermal behavior of I/O structures in order to develop a process that is robust and can withstand the challenges of today’s varied environments in which ICs are fielded. Layout, ESD pulse behavior, semiconductor physics, and device modeling are all required to produce a successful product. Your industry needs competent engineers and scientists to help achieve these goals. ESD Design and Technology is a 2 day course that offers detailed instruction on a variety of subjects pertaining to ESD design and technology. This course is designed for every manager, engineer, and technician concerned with ESD at the I/O design level, the chip level, or supplying ESD tools and simulators to the industry.
Semitracks, Inc.
Aug 4, 2008
Introduction to Integrated Circuit Packaging and Assembly
This course provides an overview of IC packaging and assembly, the current trends and the available options highlighting technical ...
PTI Seminars
Aug 5, 2008
Failure and Yield Analysis
This 3 day course offers detailed instruction on a variety of effective tools, as well as the overall process flow for locating and characterizing the defect responsible for the failure. This course is designed for every manager, engineer, and technician working in the semiconductor field, using semiconductor components or supplying tools to the industry. By focusing on a Do It Right the First Time approach to the analysis, participants will learn the appropriate methodology to successfully locate defects, characterize them, and determine the root cause of failure. Participants learn to develop the skills to determine what tools and techniques should be applied, and when they should be applied.
Semitracks, Inc.
Event Calendar    Page 1 of 8  


Clean & Efficient WLP Photoresist Removal
imageEKC162 – Tested & Proven; Faster, Too
EKC's WLP Photoresist Removers: a tested and proven solution for area array packaging requirements (stencil printed, plated, pillared or C4 applied). Removes resist faster, at lower temperatures, without attacking polyimides or metals. Learn more…
DuPont EKC Technology Advertisement




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