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White Papers relating to semiconductor packaging are posted in the order they are received. The most recent are at the top of the list.
Submit A White Paper.
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High-Speed Stamp Soldering
This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the through-hole soldering process.
Juki Automation Systems
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Ribbon Bonding for High Frequency Applications
Due to increasing frequencies in all fields of information technology, ribbon bonding is gaining more widespread attention from designers of applications which were traditionally bonded with round wire and ball bonders. This presentation will review the advantages of ribbon bonding ...
Hesse & Knipps
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Aerosol Jet Printing System for silicon solar cells
Highly efficient solar cells can be produced by applying the front side metallization in a two-step process. A seed layer is printed followed by an electroplating step to increase thickness and reduce ...
Optomec
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Process Integrated Quality Control for Wire Bonding
As costs of field failures keep increasing in many fields of electronic applications, achievement of zero failure rates of the goods delivered to the end user becomes an imperative goal to pursue. Read more ...
Hesse & Knipps
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Determining the Reliability of Tacky Fluxes
The use of tacky fluxes is common throughout the industry in applications such as ball attach, BGA repair and hand soldering. These applications employ different heating profiles ...
Kester
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BGA/CSP Re-balling
The trend in the electronics interconnect industry towards "Area Array Packages" type packages and away from high pin count leaded packages has increased dramatically over the last several years. The primary reasons are included in this white paper.
Circuit Technology Inc.
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Beating the chip counterfeiters
As components increase in complexity their cost increases, with some specialist chips selling for many hundreds of dollars. The cost of these and many other IC's make counterfeiting them a potentially lucrative business and as always there will be people ready to make a "fast buck" at the expense of someone else.
Dage Precision Industries
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Flatness measurements
Packaging coplanarity issues begin with the flatness of your substrates.
Cyber Technologies
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Photoresist Application with Ultrasonic Coating Technology
Significant improvements in coating deposition control can be achieved with advanced ultrasonic coating technology that provides precise control of film thickness for the application of Photoresist to wafers.
Ultrasonic Systems, Inc.
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Fan-Out Interposers Convert MicroBGAs to Standard Pitch
Handheld devices have a continuous hunger for smaller, more integrated semiconductor devices. To secure design wins, new ICs including memory ...
Interconnect Systems, Inc.
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